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product configuration: silicon monolithic integrated circuit the product is not designed for radiation resistance. 1/29 tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 14 ? 001 datashee t hrp7 constant current led drivers 50v 500ma 1ch source driver for automotive BD83732HFP-M /bd83733hfp-m general description BD83732HFP-M and bd83733hfp-m are 50v tolerant led current drivers. suitable for automotive led applications, it can control li ght through constant current output with control using pwm. having led open/short detective circuit and led current de-rating functions integrated, it can deliver high reliability. by utilizing rohm?s patented pbus function, it is possible to turn off all leds when a row of leds are short/open-circuited if multiple number of the ics are used in case the led connected to the output iout terminal has 2 leds in serise, BD83732HFP-M has to be used, in case of 3 leds in series - bd83733hfp-m ( refer to page.18 led open detection / disable led open detection ). features ? aec-q100 qualified ? variable form constant-current source driver ? pwm dimming function ? led constant current set by external resistor ? led current de-rating function ? led open/short detection ? disable led open detection at low power supply ? temperature protective ? abnormal output detection and output functions (pbus) application ? on-board exterior lamp (rear lamp, turn lamp, drl/position lamp, fog lamp, etc.) ? on-board interior lamp (air conditioner lamp, interior lamp, cluster light, etc.) key specifications ? input voltage range: 4.5v to 42v ? max output current: 500ma (max) ? output current accuracy: 5% (max) ? operating temperature range: -40c to +125c packages w(typ) x d(typ) x h(max) hrp7 9.395mm x 10.540mm x 2.005mm basic application circuit figure 1. typical application circuit
2/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 1234567 pbus disc crt gnd iout vin_f vin (top view) pin configurations figure 2. hrp7 package pin configuration pin descriptions hrp7 package if not used disc should be shorted to gnd. block diagram figure 3. block diagram pin no. pin name function 1 pbus error detection i/o, led curr ent de-rating input terminal 2 disc discharge setting pin 3 crt capacitor resistor timer setting 4 gnd gnd 5 iout current output 6 vin_f output current detection 7 vin power supply input fin(gnd)
3/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage v in -0.3 +50 v vin_f,crt,disc,iout,pbus terminal voltage v vin_f ,v crt ,v disc ,v iout ,v pbus -0.3 vin v power dissipation pd 2.29 (note1) w operating temperature range topr -40 125 c storage temperature range tstg -55 150 c junction temperature tjmax 150 c iout output maximum current i out 500 ma (note1) hrp7 de-rate by 18.4mw/c when operating above ta=25c please refer to page 21 below. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit supply voltage (note1) v in 4.5 42.0 v operating temperature range topr -40 125 c crtimer frequency range f pwm 100 5000 hz pwm minimum pulse width t min 10 s (note1) pd, aso should not be exceeded operating conditions parameter symbol min max unit current setting resistor r vin_f 0.36 3.6 ? capacitor connecting vin terminal c vin 1.0 - f capacitor connecting iout terminal c iout 0.1 0.66 f capacitor connecting crt terminal c crt 0.01 1.0 f dc_in pull-down resistor r dcin - 50 k ?
4/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=-40 125c, v in = 13v, r vin_f =0.47 ? , r pbus =10k ? ) parameter symbol min typ max unit condition circuit current i vin - 2.1 6.0 ma iout terminal output current accuracy i out 373 383 393 ma ta = 2 5 c 364 383 402 ma ta = - 4 0 c 125c vin ? iout drop voltage v dr_iout - 0.45 1.0 v i out =383ma iout terminal off current i iout_off - - 1 a v iout =2v, v crt =0.7v ta = 2 5 c iout current at gnd short i iout_short - 7 40 a v iout =0v current sense voltage v in_f_ref 0.171 0.180 0.189 v v in_f_ref =v in -v in_f iout voltage at led open detection v iout_open v in -0.080 v in -0.050 v in -0.020 v iout voltage at led short detection v iout_ short 0.2 0.6 1.0 v crt terminal charge current i crt_so 29.75 35.00 40.25 a v crt =0.9v crt terminal voltage v crt_cha 0.990 1.10 1.21 v crt terminal discharge voltage 1 v crt_dis1 2.7 3.0 3.3 v crtimer discharge constant v crt_cha / v crt_dis1 0.348 0.367 0.386 v/v crt terminal discharge voltage 2 v crt_dis2 3.6 4.0 4.4 v r d1<-> r d2 (note1) crt terminal charge resistance r cha 51.6 54.3 57.0 k ? r cha =(v crt_dis1 v crt_cha ) / i crt_so disc terminal discharge resistance 1 r d1 - 50.0 100 ? v crt =3.4v disc terminal discharge resistance 2 r d2 2.5 5.0 10 k ? v crt =5v pbus terminal de-rating input voltage high v dh_pbus 2.3 2.5 2.7 v S v in_f_ref = 2.0mv S v in_f_ref = v in_f_ref(@pbus = 13v) ? v in_f_ref(@pbus = vdh_pbus) pbus terminal de-rating input voltage low v dl_pbus 0.8 1.0 1.2 v i out <5a de-rating gain g d 114 120 126 mv/v S i out =g d v pbus v pbus =1.5v -> 2.0v pbus terminal low voltage v ol_pbus - - 0.7 v i pbus =2ma pbus terminal input current i in_pbus - 38.0 100 a v pbus =13v disable open detection during low power supply voltage BD83732HFP-M v m_open 7.30 7.65 8.00 v vin voltage bd83733hfp-m v m_open 10.5 11.0 11.5 v vin voltage
5/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) (unless otherwise specified ta=25c, v in =13v, r crt =3.9 , c crt =0.033 f, c iout =0.1 f ) figure 5. r vin_f vs i out i out =(i out /(0.18v/r vin_f )-1) 100[%] figure 4. r vin_f vs i out figure 7. pbus vs v in_f_ref figure 6.temperature vs v in_f_ref
6/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ta = - 4 0 c ta=25c ta=125 c crt =0.033 f, ? r crt =3.9k ? (on-duty 6.7% setting) iout = open figure 8. v crt vs i crt_so (v crt :crt terminal voltage) figure 9. temperature vs pwm on duty figure 10. BD83732HFP-M led disable open detection voltage figure 11. bd83733hfp-m led disable open detection voltage figure 12. temperature vs de-rating gain iout = open
7/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 [a] r v r ) v (v i vin_f in_f_ref vin_f in_f in out = ? = functional description (unless otherwise specified, ta=25c, v in =13v, i out =6v and r vin_f =0.47 ? . numbers are "typical" values.) 1. output current setting led current i out can be set by value of resistor r vin_f . where: v in_f_ref is 0.18v (typ) figure 13. output current setting 2. table of operations the pwm dimming mode switches to linear control depending on crt terminal voltage. when v crt > v crt_dis2 ( typ ~ 4.0v ), dimming mode turns to linear control, and discharge resistance of disc terminal changes from r d1 ( typ ~ 50 ? ) to r d2 ( typ ~ 5k ? ). when an led open/short-circuit fault is det ected, which depends on iout terminal voltage, the output current is turned off. output current is also turned off when pbus terminal is pulled low. operation mode crt terminal iout terminal voltage (v iout ) output current (i out ) pbus terminal linear control 4.0v(typ) v crt - 50ma 500ma hi-z pwm dimming open - see features functional description, 3. pwm dimming operation using external rc network hi-z led current de-rating - - see features description, 9. led current de-rating function pbus<2.5v led open - v iout vin - 0.050v(typ) 1 a(max) low output led short - v iout 0.6v(typ) 40 a(max) low output pbus control off - - 1 a(max) low input
8/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 [s] c r i c ? v t1 crt cha crt_so crt crt = = 3. pwm dimming operation using external rc network pwm dimming is performed with the following circuit. the cr timer function is activated if crt terminal is open . to perform pwm light control of led current, a triangular waveform is generated at crt terminal. the led current is turned off while crt voltage is ramping up, and led current is turned on while crt voltage is ramping down. the ramp up/down time of the crt voltage, and therefore the di mming cycle and duty, can be set by values of the external components (c crt , r crt ) . please connect disc to gnd if it is not used. figure 14. pwm dimming operation (1) crt ramp up time t1 crt ramp up time can be obtained from the following equations: where: i crt_so is the crt terminal charge current 35 a (typ) r cha is the crt terminal charge resistance 54.3k ? (typ) crt voltage ramp-up crt voltage ramp-down crt terminal waveform i out waveform vref iout vin v in -0.180v (typ) gnd vin_f osc crt disc i crt =35a(typ) 50 ? (typ) +b i out c crt r crt on/off
9/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 [s] v v ln ) r r ( c t2 crt_dis1 crt_cha d1 crt crt ? ? ? ? ? ? ? ? + ? = [hz] 2 t 1 t 1 f pwm + = 2 t 1 t 2 t d on + = (2) crt ramp down time t2 crt ramp down time is defined by the discharge period due to the external capacitor c crt and resistance (r crt + r d1 ). the crt terminal charge current is off at crt ramp down. make sure that t2 is set > pulse width 20 s (min). where: r d1 is the crt terminal discharge resistance 1 50 ? (typ) v crt_cha is the crt terminal discharge on voltage 1.1v (typ) v crt_dis1 is the crt terminal discharge on voltage 3.0v (typ) (3) dimming frequency f pwm pwm frequency is defined by t1 and t2. (4) on duty (d on ) like the above, pwm on duty is defined by t1 and t2. (example) in case of f pwm = 518hz and 6.7% duty (typ), from f pwm =518hz; t1 + t2 = 1 / f pwm = 1 / 518hz = 1931 s from on duty = 6.7%; crt ramp up time t1 is t1 = (t1 + t2) 0.933 = 1801.6 s external capacity c crt is; c crt = t1 (i crt / ? v crt ) = 1800.7 s 35 a / 1.9v P 0.033 f crt ramp down time t2 is; t2 = (t1 + t2) 0.067 = 129 s external resistance r crt is; r crt = t2 / (c crt ln(v crt_cha / v crt_dis )) r d1 = 129usec / (0.033 f ln(1.1 / 3.0) ? 50 ? ) P 3.9k ? pwm dimming operation using external signal an external microcomputer can directly drive the pwm signal for dimming crt terminal. in that case, ?high? level voltage of pwm signal should be > v crt_dis2( 4.4v(max)) and ?low? level voltage of pwm signal < v crt_cha (0.99v(min)). figure 15. external input of pwm signal
10/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 about a reverse connection protection diode in case you apply voltage the crt over the reverse protecti on diode (d3) as the figure below ( figure 16), there is a possibility that the crt rise time and fall time will deviate from the settings due to reverse current of diode (d3) affecting charge and discharge current to capacitance(c3). reverse cu rrent ir is getting high value with high temperatures, so the diode recommended by rohm or a diode with reverse current characteristics below max 1 a needs to be considered. besides, since reverse current causes also in the recommended diode, a resistor of about 1k needs to be connected between the a-point and gnd , so that voltage in the a-point doesn?t rise. crt start-up / fall time mechanism of deviation from settings during the pwm dimming operation mode, the a-point on figure.16 becomes hi-z reverse current ir of d2 and d3 goes to the a-point (power supply voltage is being input into the cathode of d2 , so reverse current of d2 goes to mainly into c1) ? reverse current ir of d3 is added to the crt terminal charge current i crt_so and discharge current i dis , so crt start-up / fall time deviates from the settings. c1 gets charged, voltage in the a-point rises voltage in the a-point exceeds voltage in crt terminals of each ic vf occurs in the diodes d3 d3 circulate forward current if ? forward current if of d3 is added to the crt terminal charge current i crt_so and discharge current i dis , so crt start-up / fall time deviates from the settings. repetition - figure 16. about the mechanism of deviation of crt start-up / fall time due to the reverse connection prevention diode
11/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 setting vin range number of led connections n shoul d meet the following conditions: v f_led n +b ? v f_diode ?v in_f_ref ?v dr_iout where: +b is the battery voltage v f_diode is the reverse connection preventing diode vf v in_f_ref is the vin_f terminal voltage (v in ? v in_f ) v dr_iout is the iout terminal drop voltage v f_led is the led vf ( maximum ) n is the number of led levels example : if you want to supply constant current to led at 9v or higher battery voltage (+b) (supposing that v f_diode is 0.5v), v f_led n +b ? v f_diode v in_f_ref v dr_iout = 9v ?0.5v ?0.189v(max) ? 1.0v(max) = 7.311v (sum of vf of led connected to iout terminal is set to be 7.311v max.) figure 17. led setting range schematic v f_led n v in_f_ref v f_diode i out vin_f vin crt disc pbus iout gnd BD83732HFP-M bd83733hfp-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus2 c iout +b dc_in pwm_in fin r pbus1 r thm z d2 r dcin
12/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 4. self-protection and pbus functionality this ic includes self-protection from short/open-circuit of led, and reports abnormal condition at the pbus terminal. (1) led open detection function when any led connected to iout terminal is open-circuit ed, it is detected by ov ervoltage at iout terminal (v out > v iout_open ). then the output current is tur ned off and pbus terminal is pulled low. figure 18. led open detection (2) led short-circuit detective function when the leds connected to the iout terminal are short-circ uited, it is detected by a low voltage at iout terminal (v out < v iout_short ). then the output current is turned off to prevent thermal destruction of ic, and pbus terminal is pulled to low. figure 19. led short-circuit detection (3) iout current at gnd short(i iout_short ) in this case, iout current at gnd short(i iout_short ) flows from iout terminal. the value depends upon v out . figure 20. about iout current at gnd short
13/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (4) prevention of false led short detection during pwm when in linear control mode, led open & shor t circuit detection are active continuously. in pwm dimming mode, led open detection is active only during the fall time of v crt , but led short circuit detection is active at all time. (refer to figure20.) when iout is disabled during pwm, the output will be high impedance ( ?hi-z?). during this time noise (note1) can couple on to this pin and cause false detection of short condition. to prevent this it is necessary to connect a capacitor(more than 0.1uf (note2) ) between iout terminal and gnd terminal nearby terminal (rohm recommended value : c iout =0.1 f gcm188r11h104ka42 murata) (note1) conducted noise, radiated noise, interference of connecter and pcb pattern etc? (note2) if more than 0.1uf, please evaluate the time of v in on to i iout on. linear control mode pwm dimming mode 0v 0v 0v 0ma v in v crt v iout i iout 0v 0v 0ma v in v crt v iout i iout none figure 21. timing of led open & short circuit detection function and iout terminal hi-z zone figure 22. about the capacitor of connecting iout terminal led open detection iout terminal hi-z zone led short circuit detection active active active active hi-z hi-z hi-z active active led open detection iout terminal hi-z zone led short circuit detection vin_f vin crt disc pbus iout gnd BD83732HFP-M bd83733hfp-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus2 c iout +b dc_in pwm_in fin r pbus1 r thm z d2 r dcin
14/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 evaluation example (i iout pulse width at pwm dimming operation) (5) about the maximum value of the capacitor connected to the output in case a capacitor exceeding the recommended range (above 0.66 f) is connected to the iout terminal, there is a possibility that delay time of start-up will reach about se veral hundred ms, so special attention is needed. below an evaluation example is mentioned as reference data. measurement conditions v in =13v , ta=25c, r vin_f =3.6 , led 3 steps, linear control mode figure 23. about the capacitor connected to the iout terminal condition +b=13v ta=25c led 3strings r crt =560 ? c crt =0.033 f pwm dimming mode vin 10v/div pbus 10v/div iiout 20ma/div 50msec/div 6.6uf 0.1~0.66uf
15/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pbus function the pbus terminal is an input/output terminal fo r outputting trouble and inputting trouble detection. when an led open/short-circuit occurs, the pbus terminal output is pulled low (note1) . it is possible to turn output current off by pulling the pbus terminal low. (note1) pbus terminal is an open drain te rminal. it should always be pulled up(10k ? ) to power supply voltage. when multiple ics are used to drive multiple leds, as shown in t he drawing below, it is possible to turn off all rows of leds if only some leds are short/open-circuited by connecting pbus terminal of each ic. figure 24. pbus function example of protective oper ation due to led open circuit figure 25. example of protective operation if led open occurs, pbus of ch1 is switched from hi- z to low output. as pbus becomes low, led drivers of other ch detect the condition and turns off their own leds. viout clamps to 1.4v (typ) during the off period, in order to prohibit ground fault detection. vin_f iout pbus hi-z ? low led open crt pbus +b protect bus vin_f iout crt pbus vin_f iout crt pbus led off led off open vin vin vin trouble occurs connect pbus of each ch possible to turn off all leds led open 1 output voltage is brought up when led open occurs. 2 led current turns off. 3 pbus output become low. 4 turns off led current of other ic. clamp to 1.4v during off clamp to 1.4v during off ch1 ch2 ch3 connect pbus of each ch
16/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 5. caution when using multiple ic with different power supplies each input terminal has a built- in esd protection diodes. (refer to i/o equivalence circuits ) if the vin terminal is not supplied and other input terminals are supplied voltage, the ic may malfunction(abnormal operation mode, abnormal led lighting ) due to arise vin terminal voltage . the application example of accidental operation is below. tail stop vin vin_f crt disc pbus gnd gnd vin pbus gnd tail v in (b) v pbus (b) v in (a) stop l l l h h l h l h l h v crt (b) ab ? due to voltage arises vin(a), crt(b) is not triangle wave output figure 26. application example (operational explanation) only input tail : arise vin terminal voltage of ic a from esd protection diode between vin terminal and pbus terminal of ic a. due to connect vin terminal of ic a and crt terminal of ic b across diode, dc voltage inputs crt terminal of ic b, so it is possible to operate ic b dc mode. 6. led current de-rating function bd83733/32 has an led current de-rating functionality. wh en the pbus terminal voltage falls below 2.5v(typ), led current output decreases with vin_f_ref voltage reduction . in order to eliminate oscillating of the output current, a capacitor is required at the pbus terminal. besides, in case of connecting the pbus terminals between the series model bd8371xxx/bd8372xxx/bd8374xxx and the bd83733/32hfp-m, the series model except bd83733/ 32 will be turned off during the de-rating operation. figure 27. led current de-rating function characteristics
17/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 timing chart figure 28. timing chart c if pwm_in is switched on, v crt will start oscillation, and led current i out will follow this waveform. (pwm light control mode) d if dc_in is switched on, v crt will be pulled high (v in -vf). led current i out will be continuous. (linear control mode) e if led becomes open, led current i out will stop. at the same time, v pbus goes low. f if led is short-circuited to gnd, led current i out will stop. at the same time, v pbus goes low. b+ dc_in pwm_in vref iout osc vin_f vin crt vref disc pbus vin- 0.05v (typ) led open det 0.6v (typ) led gnd short det vin-0.180v (typ) gnd on/off led current derate 7.65v/11.0v (typ) (BD83732HFP-M /bd83733hfp-m) led open det mask fin
18/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operation range of constant current control operation range of constant current control can be obtained from the following equation: operation range of cons tant current control v in v f_led n + v in_f_ref + v dr_iout [v] where: v in is the vin terminal voltage v f_led is the led vf n is the: number of led levels v in_f_ref is the vin_f terminal voltage (v in - v in_f ) v dr_iout is the iout terminal drop voltage led open detection / disable led open detection range this feature is implemented to detect a si gnificant power supply voltage drop at start-up and shut-down, and to disable led open detection. in case of low power supply (vin) close to le d forward voltage (viout), the device disables the diagnostic function of led open to avoid any false open load detection. at enough power supply higher than the v m_open (threshold of disable led open detection), when the iout terminal (v iout ) exceeds the v iout_open ( led open detection threshold ) by actual led open load , the pbus output will be low. the led forward voltage has to be set lower than the v m_open as following equation. v m_open v f_led n + 50mv(typ) + v dr_iout [v] led open detection voltage at iout v iout_open = v in - 50mv(typ) disable led open detection at vin voltage BD83732HFP-M : v m_open = 7.65v (typ) bd83733hfp-m : v m_open = 11.0v (typ) figure 29. guaranteed range of current accuracy and led open detection / disable led open detection range.
19/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 how to connect led if multiple rows of leds are connected, not e that open circuit may not be detected. (1 series) (2 or more parallel rows) (matrix connection) figure 30. led connection patterns connection pattern led short-circuit detection (gnd short of iout terminal) led open detection 1 series detectable detectable- 2 parallels or more detectable non-detectable (note 1) 2 parallels or more (matrix connection) detectable non-detectable (note 2) (note1) : detectable only when one or more leds become open in all rows. (note2) : detectable only when all leds on the same level become open. 1st level 2nd level 3rd level 1st ro w 2nd row nth ro w
20/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 recommended application circuit figure 31. recommended application circuit no. component name component value product name company 1 d1 - rfn1l6s rohm 2 d2 - rfn1l6s rohm 3 d3 - rfn1l6s rohm 4 z d1 - tnr12h-220k nippon chemicon 5 z d2 - ftz5.6e rohm 6 c vin 4.7f gcm32er71h475ka40 murata 7 r vin_f 0.91 ? ltr10 series rohm 8 r pbus1 1k ? esr03 series rohm 9 r pbus2 13k ? esr03 series rohm 10 c crt 0.033f gcm188r11h333ka40 murata 11 r crt 3.9k ? mcr03 series rohm 12 c iout 0.1f gcm188r11h104ka42 murata 13 r thm 150k ? ntcg104lh154h tdk 14 r dcin 5.1k ? esr03 series rohm table 1. bom list pwm_in dc_in mode low low off high low pwm dimming mode (n o t e 1 , n o t e 2) (14ma 6.7% on duty@518hz) low high linear control mode (n o t e 2) (200ma 100% on duty) high high linear control mode (n o t e 2) (200ma 100% on duty) (note1) see functional description "3. pwm dimming operation." (note2) see functional description "2. table of operations." table 2. table of operations figur e 32. example of waveform measurement vin_f vin crt disc pbus iout gnd BD83732HFP-M bd83733hfp-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus2 c iout +b dc_in pwm_in fin r pbus1 r thm z d2 r dcin
21/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 thermal loss figure 33. application circuit diagram for thermal description thermal design should meet the following equation: pd > pc pd = (1/ ja) (tjmax - ta) or (1/ jc) (tjmax - tc) pc = (+b ? v f_diode - v in_f_ref ? v f_led n)i out + i vin v in where: pd is the power dissipation pc is the power consumption +b is the battery voltage v f_diode is the reverse connection preventing diode vf v in_f_ref is the vin_f terminal voltage (v in -v in_f ) v f_led is the led vf n is the number of led levels i out is the output current i vin is the circuit current v in is the power supply voltage ja is the thermal resistance between tj and ta jc is the thermal resistance between tj and tc tjmax is the max joint temperature (150c) ta is the ambient temperature tc is the case surface temperature v f_led n v in_f_ref v f_diode i out vin_f vin crt disc pbus iout gnd BD83732HFP-M bd83733hfp-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus2 c iout +b dc_in pwm_in fin r pbus1 r thm z d2 r dcin
22/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 5.0 0.0 4.0 0 25 50 75 100 125 150 temp ta [ ] power dissipation pd [w] 4.16w 2 layer copper foil 50mm x 50mm ja = 30 /w 3.0 2.0 1.0 2.3w 1.6w 2 layer copper foil 15mm x 15mm ja = 54.4 /w 1 layer ja = 78.1 /w hrp7 package (caution1) when mounted with 70.0mm x 70.0mm x 1.6mm glass epoxy substrate. (caution2) above copper foil area indicates backside copper foil area. (caution3) value changes according to number of substrate layers and copper foil area. note that this value is a measured value, not a gua ranteed value. figure 34. thermal dissipation curve
23/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 thermal design for small number of leds if there are few led lamps, it is suggested to insert resi stance between iout terminal and led to reduce heat generation in the ic and dissipate heat. (this does not apply where amperage is low.) in that case, the range of cu rrent accuracy will be as shown in the following equation: +b v f_diode + v f_led n + v in_f_ref + v dr_iout +i out r1 v f_diode is the reverse connection preventing diode vf v f_led is the led vf n is the number of led levels v in_f_ref is the vin_f terminal voltage (v in - v in_f ) v dr_iout is the iout terminal drop voltage i out is the output current r1 is the thermal dissipation resistance thermal design should meet the following equation when inserting thermal dissipation resistance: pd = (1/ ja) (tjmax - ta) or (1/ jc) (tjmax - tc) pc = (+b ? v f_diode - v in_f_ref ? v f_led n)i out + i vin v in pd is the power dissipation pc is the power consumption +b is the battery voltage v f_diode is the reverse connection preventing diode vf v in_f_ref is the vin_f terminal voltage (v in - v in_f ) v f_led is the led vf n is the number of led levels i out is the output current r1 is the thermal dissipation resistance i vin is the circuit current v in is the power supply voltage ja is the thermal resistance between tj and ta jc is the thermal resistance between tj and tc tjmax is the max joint temperature (150c) ta is the ambient temperature tc is the case surface temperature figure 35. example of how to connect thermal dissipation resistance vin_f vin crt disc pbus iout gnd BD83732HFP-M bd83733hfp-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus2 c iout +b dc_in pwm_in fin r pbus1 r thm z d2 r dcin r1 i out v f_diode v in_f_ref v f_led n thermal dissipation resistance
24/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits number terminal name equivalence circuit 1 pbus 2 disc r d2 = 5k (typ) vin (7pin) gnd (4pin) disc (2pin) r d1 = 50 (typ) 3 crt 4 gnd - 5 iout 6 vin_f 7 vin -
25/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lin es of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong elec tromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
26/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes ? continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 36. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that ex ceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 16. input voltage fluctuation in case input voltage fluctuations are fast, there is a possibilit y that rush current above the rated value will flow into the output mosfet. therefore, please, set the capacity value of the capacitor connected to the vin terminal after paying enough attention to the actual application in accordance with specifications.
27/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information bd83732hfp - mtr package hfp:hrp7 packaging and forming specification m: high reliability design tr: embossed tape and reel (hrp7) bd83733hfp - mtr package hfp:hrp7 packaging and forming specification m: high reliability design tr: embossed tape and reel (hrp7) marking diagrams hrp7 (top view) bd83733hfp part number marking lot number 1pin mark hrp7 (top view) bd83732hfp part number marking lot number 1pin mark
28/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name hrp7
29/29 datasheet d a t a s h e e t BD83732HFP-M / bd83733hfp-m tsz02201-0g1g0c700310-1-2 ? 2014 rohm co., ltd. all rights reserved. 4.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 29.aug.2014 001 new release 10.no v .2014 002 page.1, 10, 11, 13, 17, 20, 21, 23 application circuit revised page.3 recommended operating conditions change rating pwm minimum pulse width 20s 10s change to operating conditi ons parameter current setting resistor ,capacitor connecting vin terminal and capacitor connecting iout terminal operating conditions add capacitor connecting crt terminal and dc_in pull-down resistor parameter. page.20 bom list revised
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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